For FEOL and BEOL processes like roughness etching, stress relief, polishing and film removel.
SpinEtcher from SEMI|PARTS. Our proved tool for FEOL and BEOL processes.
BENEFITS
> Up to 5 media in one process bowl
> Backside protection chuck
> Low chemical and water consumption
> Chemical recirculation and recycling
> Front- and backside handling selectable in the recipe
> High safety levels for chemicals
> Easy upgrade to second process bowl
> Easy to change wafer size
> Optimized footprint
APPLICATIONS
The SpinEtcher SPE 200 is designed for processes like:
> Roughness etching
> Stress relief
> Polishing
> Film removal
OPTIONS
> Thin wafer handling
> Mini chemical dispense and mixture systems
> Endpoint detection
> Concentration monitoring
> Spiking unit
> SECS GEM interface
> SMIF or open carrier handling
> Wafer ID/Barcode reader
> Efficient chuck and bowl cleaning system
> Ionization unit
